Amkor Technology, Inc. (AMKR)
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No price history available.
Key financial summary
Financials in USD| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | $m | 5,051 | 6,138 | 7,092 | 6,503 | 6,318 | 6,708 | 7,458 | 7,660 |
| Operating profit | $m | 467 | 644 | ||||||
| Net profit | $m | 338 | 643 | 766 | 360 | 354 | 374 | 555 | 645 |
| EPS reported | $ | 1.50 | 2.23 | ||||||
| Operating cashflow per share | $ | 4.43 | 4.83 | ||||||
| Capex per share | $ | 3.66 | 2.74 | ||||||
| FCF per share | $ | 0.77 | 2.08 | ||||||
| Free cash flow | $m | 191 | 516 | ||||||
| Net debt | $m | -474 | -26 | ||||||
| Book value equity | $m | 4,471 | 4,650 | ||||||
| Book value per share | $ | 18.01 | 18.63 | ||||||
| Number of shares | m | 248.3 | 249.57 | ||||||
| DPS (TTM paid) | $ | 0.33 | 0.33 |
Financial summary
Financials in USD| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E TTM | x | 26.32 | 24.04 | ||||||
| P/B LTM | x | 2.18 | 2.10 | ||||||
| P/S LTM | x | 1.45 | 1.31 | ||||||
| P/FCF LTM | x | 51.09 | 18.91 | ||||||
| EV/EBITDA LTM | x | 8.56 | 7.15 | ||||||
| EV/Sales LTM | x | 1.48 | 1.72 | ||||||
| Earnings Yield LTM | % | +3.80% | +4.16% | ||||||
| FCF Yield | % | +1.96% | +5.29% | ||||||
| Quality | |||||||||
| ROE | % | +8.36% | +12.37% | ||||||
| ROIC | % | +5.98% | +7.29% | ||||||
| Operating margin | % | +6.97% | +8.64% | ||||||
| Gross margin | % | +13.99% | +15.51% | ||||||
| FCF/Sales | % | +2.85% | +6.92% | ||||||
| Growth and momentum | |||||||||
| EPS Growth YoY | % | +4.90% | +55.94% | ||||||
| Sales Growth YoY | % | +6.18% | +18.04% | ||||||
| Net Income Growth YoY | % | +5.62% | +56.90% | ||||||
| FCF Growth | % | -44.65% | +49.55% | ||||||
| Operating Profit Growth | % | +6.60% | +46.89% | ||||||
| Dividend and capital structure | |||||||||
| Dividend Yield | % | +0.84% | +0.70% | ||||||
| Dividend Growth | % | +40.36% | +41.41% | ||||||
| Payout Ratio | % | +22.00% | +14.86% | ||||||
| FCF/Debt | x | 0.12 | 0.20 | ||||||
| Net Debt/EBITDA | x | 0.16 | 0.72 | ||||||
| EBIT/Net interest | x | 6.20 | 8.42 | ||||||
| Net debt/market cap | % | +15.55% | +20.94% | ||||||
| Net debt/Equity | x | -0.11 | -0.01 | ||||||
| Gross debt/equity | x | 0.35 | 0.55 | ||||||
Price target estimates
Based on consensus from external analysts. Not Kvantra's opinion.
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
ESG
| Metric | 2024 | 2025 | 2026 |
|---|---|---|---|
| ESG-score | |||
| Environmental score | |||
| Social score | |||
| Governance score | |||
| Risk rating |
Company overview
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Consensus from external analysts. Not Kvantra's opinion.
Based on consensus from external analysts. Not Kvantra's opinion.
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
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