Stock profile

Amkor Technology, Inc.(AMKR)

Country: United States of AmericaSector: TechnologyIndustry: SemiconductorsExchange: NASDAQ
P/E TTM
25.9
History
P/E NTM
22.1
Market cap
13.6B
Currency USD
KvantraRanki51
Value84
Quality44
Momentum9
Current price
57.75+3.89%
Benchmarks

No price history available.

Key financial summary

Financials in USD
202020212022202320242025TTM2026E
Total revenue$m5,0516,1387,0926,5036,3186,708N/AN/A
Operating profit$mLockedLockedLockedLockedLockedLockedLockedLocked
Net profit$m338643766360354374N/AN/A
EPS reported$LockedLockedLockedLockedLockedLockedLockedLocked
Operating cashflow per share$LockedLockedLockedLockedLockedLockedLockedLocked
Capex per share$LockedLockedLockedLockedLockedLockedLockedLocked
FCF per share$LockedLockedLockedLockedLockedLockedLockedLocked
Free cash flow$mLockedLockedLockedLockedLockedLockedLockedLocked
Net debt$mLockedLockedLockedLockedLockedLockedLockedLocked
Book value equity$mLockedLockedLockedLockedLockedLockedLockedLocked
Book value per share$LockedLockedLockedLockedLockedLockedLockedLocked
Number of sharesmLockedLockedLockedLockedLockedLockedLockedLocked
DPS (TTM paid)$LockedLockedLockedLockedLockedLockedLockedLocked

Financial summary

Financials in USD
202020212022202320242025TTM2026E
Value
P/E LTMxLockedLockedLockedLockedLockedLockedLockedLocked
P/B LTMxLockedLockedLockedLockedLockedLockedLockedLocked
P/S LTMxLockedLockedLockedLockedLockedLockedLockedLocked
P/FCF LTMxLockedLockedLockedLockedLockedLockedLockedLocked
EV/EBITDA LTMxLockedLockedLockedLockedLockedLockedLockedLocked
EV/Sales LTMxLockedLockedLockedLockedLockedLockedLockedLocked
Earnings Yield LTM%LockedLockedLockedLockedLockedLockedLockedLocked
FCF Yield%LockedLockedLockedLockedLockedLockedLockedLocked
Quality
ROE%LockedLockedLockedLockedLockedLockedLockedLocked
ROIC%LockedLockedLockedLockedLockedLockedLockedLocked
Operating margin%LockedLockedLockedLockedLockedLockedLockedLocked
Gross margin%LockedLockedLockedLockedLockedLockedLockedLocked
FCF/Sales%LockedLockedLockedLockedLockedLockedLockedLocked
Growth and momentum
EPS Growth YoY%LockedLockedLockedLockedLockedLockedLockedLocked
Sales Growth YoY%LockedLockedLockedLockedLockedLockedLockedLocked
Net Income Growth YoY%LockedLockedLockedLockedLockedLockedLockedLocked
FCF Growth%LockedLockedLockedLockedLockedLockedLockedLocked
Operating Profit Growth%LockedLockedLockedLockedLockedLockedLockedLocked
Dividend and capital structure
Dividend Yield%LockedLockedLockedLockedLockedLockedLockedLocked
Dividend Growth%LockedLockedLockedLockedLockedLockedLockedLocked
Payout Ratio%LockedLockedLockedLockedLockedLockedLockedLocked
FCF/DebtxLockedLockedLockedLockedLockedLockedLockedLocked
Net Debt/EBITDAxLockedLockedLockedLockedLockedLockedLockedLocked
EBIT/Net interestxLockedLockedLockedLockedLockedLockedLockedLocked
Net debt/market cap%LockedLockedLockedLockedLockedLockedLockedLocked
Net debt/Equity%LockedLockedLockedLockedLockedLockedLockedLocked
Gross debt/equity%LockedLockedLockedLockedLockedLockedLockedLocked

Price target estimates

Low estimateLocked
High estimateLocked
Price consensusLocked
Last year average price targetLocked
Current price57.75
Return PotentialLocked

Based on consensus from external analysts. Not Kvantra's opinion.

Ratings

Strong Buy
Locked
Buy
Locked
Hold
Locked
Sell
Locked
Strong Sell
Locked
Number of covering analystsLocked

Based on consensus from external analysts. Not Kvantra's opinion.

ESG

Metric202420252026
ESG-scoreLockedLockedLocked
Environmental scoreLockedLockedLocked
Social scoreLockedLockedLocked
Governance scoreLockedLockedLocked
Risk ratingLockedLockedLocked

Company overview

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

SectorTechnology
IndustrySemiconductors
CountryUnited States of America
Trades inUSD

Similar companies

For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.

Amkor Technology, Inc. (AMKR)

AMKR · NASDAQ · Technology
57.75+3.89%
Sign up to track this stock

No price history available.

KvantraRank51
P/E TTM25.9
P/E NTM22.1
Market cap13.6B
KvantraRank51 / 100
Value
84
Quality
44
Momentum
9
Financialsin USD
20242025TTM2026E
Analyst target
ConsensusLocked
Current57.75
UpsideLocked
LockedLocked
Price consensusLocked
Last year average price targetLocked
Current price57.75
Return PotentialLocked

Consensus from external analysts. Not Kvantra's opinion.

Ratings
Strong Buy
Locked
Buy
Locked
Hold
Locked
Sell
Locked
Strong Sell
Locked

Based on consensus from external analysts. Not Kvantra's opinion.

ESG
202420252026
ESG-scoreLockedLockedLocked
Environmental scoreLockedLockedLocked
Social scoreLockedLockedLocked
Governance scoreLockedLockedLocked
Risk ratingLockedLockedLocked
About

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

SectorTechnology
IndustrySemiconductors
CountryUnited States of America
Trades inUSD

For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.

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