No price history available.
Key financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | CNYm | 10,769 | 15,812 | 21,429 | 22,269 | 23,882 | 27,921 | N/A | N/A |
| Operating profit | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | CNYm | 338 | 957 | 502 | 169 | 678 | 1,219 | N/A | N/A |
| EPS reported | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Tongfu Microelectronics Co.,Ltd specializes in delivering integrated circuit (IC) packaging and testing solutions for the semiconductor sector. The company provides a comprehensive suite of semiconductor testing services, encompassing wafer probing, strip testing, final validation, and system-level assessments. Furthermore, Tongfu Microelectronics extends its offerings to include specialized test platform and engineering support for a wide array of devices. These devices span analog and mixed-signal components, automotive electronics, radio frequency modules, high-performance computing devices, baseband processors, memory units, LCD drivers, System-in-Package (SiP) solutions, power modules, and various other integrated circuits. Key product categories benefiting from their testing expertise include CPUs, GPUs, gaming consoles, and networking equipment. Established in 1997, Tongfu Microelectronics Co.,Ltd is headquartered in Nantong, China, and adopted its current name in December 2016, having previously operated as Nantong Fujitsu Microelectronics Co., Ltd.
Similar companies
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Tongfu Microelectronics Co.,Ltd (002156.SZ)
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Tongfu Microelectronics Co.,Ltd specializes in delivering integrated circuit (IC) packaging and testing solutions for the semiconductor sector. The company provides a comprehensive suite of semiconductor testing services, encompassing wafer probing, strip testing, final validation, and system-level assessments. Furthermore, Tongfu Microelectronics extends its offerings to include specialized test platform and engineering support for a wide array of devices. These devices span analog and mixed-signal components, automotive electronics, radio frequency modules, high-performance computing devices, baseband processors, memory units, LCD drivers, System-in-Package (SiP) solutions, power modules, and various other integrated circuits. Key product categories benefiting from their testing expertise include CPUs, GPUs, gaming consoles, and networking equipment. Established in 1997, Tongfu Microelectronics Co.,Ltd is headquartered in Nantong, China, and adopted its current name in December 2016, having previously operated as Nantong Fujitsu Microelectronics Co., Ltd.