Shinko Electric Industries Co., Ltd., a Fujitsu Limited subsidiary established in Nagano, Japan, in 1946, specializes in manufacturing and supplying a comprehensive array of semiconductor packages and related components. The company caters primarily to semiconductor and electronics manufacturers. Its product lineup features various IC packages, including plastic-BGA substrates, build-up substrates, and lead frames. Additionally, Shinko Electric develops advanced packaging solutions such as molded core embedded packages, which serve as substitutions for package-on-package (PoP) and system-in-package (SiP) applications, as well as for small modules. It also provides high heat dissipation and high-density flip chip packages, vital for automotive infotainment and image processing processors. The company further offers module assembly solutions and supports copper pillar technology, a method for connecting interposers with semiconductor chips using thermal compression flip chip techniques. Beyond packaging, Shinko Electric manufactures essential components like glass-to-metal seals, heat spreaders, and ceramic electrostatic chucks. Complementing its product offerings, the company delivers extensive testing services covering electrical properties, automated solder ball inspection, temperature cycle screening, baking, and efficient tray and tape packing.