No price history available.
Key financial summary
Financials in JPY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | ¥m | 97,105 | 133,277 | 146,801 | 134,680 | 150,534 | 166,839 | N/A | N/A |
| Operating profit | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | ¥m | 12,175 | 21,441 | 23,630 | 19,378 | 25,637 | 24,739 | N/A | N/A |
| EPS reported | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in JPY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Tokyo Seimitsu Co., Ltd., established in Hachioji, Japan, in 1949, specializes in the production and sale of advanced semiconductor manufacturing equipment (SPE) and precision measurement tools. The company's operations are divided into two main segments: SPE and Metrology Equipment. Within its SPE division, Tokyo Seimitsu provides a comprehensive suite of machinery crucial for wafer processing, including dicing machines, high-precision dicing blades, probing machines, polish grinders, robust high-rigidity grinders, chemical mechanical planarizers (CMPs), wafer edge grinding machines, and specialized systems for demounting and cleaning sliced wafers. The Metrology Equipment segment offers an extensive array of measuring instruments. This includes multipurpose devices like coordinate measuring machines, instruments for analyzing surface texture, contour, roundness, and cylindrical profiles, as well as optical and optical shaft measuring systems, and X-ray CT systems. Furthermore, the company develops automatic measurement solutions such as in-process and post-process gauge products, various sensors, electric and air micrometers, high-precision digital measurement instruments, and laser interferometers. The company adopted its current name, Tokyo Seimitsu Co., Ltd., in April 1962, having previously operated as Tokyo Seimitsu Kogu Co., Ltd.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
Tokyo Seimitsu Co., Ltd. (7729.T)
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Tokyo Seimitsu Co., Ltd., established in Hachioji, Japan, in 1949, specializes in the production and sale of advanced semiconductor manufacturing equipment (SPE) and precision measurement tools. The company's operations are divided into two main segments: SPE and Metrology Equipment. Within its SPE division, Tokyo Seimitsu provides a comprehensive suite of machinery crucial for wafer processing, including dicing machines, high-precision dicing blades, probing machines, polish grinders, robust high-rigidity grinders, chemical mechanical planarizers (CMPs), wafer edge grinding machines, and specialized systems for demounting and cleaning sliced wafers. The Metrology Equipment segment offers an extensive array of measuring instruments. This includes multipurpose devices like coordinate measuring machines, instruments for analyzing surface texture, contour, roundness, and cylindrical profiles, as well as optical and optical shaft measuring systems, and X-ray CT systems. Furthermore, the company develops automatic measurement solutions such as in-process and post-process gauge products, various sensors, electric and air micrometers, high-precision digital measurement instruments, and laser interferometers. The company adopted its current name, Tokyo Seimitsu Co., Ltd., in April 1962, having previously operated as Tokyo Seimitsu Kogu Co., Ltd.
