No price history available.
Key financial summary
Financials in USD| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | TTM | 2027E | ||
|---|---|---|---|---|---|---|---|---|---|---|
| Total revenue | $m | 22 | 17 | 51 | 65 | 66 | 59 | 50 | N/A | N/A |
| Operating profit | $m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | $m | -3 | -2 | 9 | 15 | 33 | -4 | -7 | N/A | N/A |
| EPS reported | $ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | $ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | $ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | $ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | $m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | $m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | $m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | $ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | $ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in USD| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | TTM | 2027E | ||
|---|---|---|---|---|---|---|---|---|---|---|
| Value | ||||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | ||||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | ||||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | ||||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Price target estimates
Based on consensus from external analysts. Not Kvantra's opinion.
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
ESG
| Metric | 2024 | 2025 | 2026 |
|---|---|---|---|
| ESG-score | Locked | Locked | Locked |
| Environmental score | Locked | Locked | Locked |
| Social score | Locked | Locked | Locked |
| Governance score | Locked | Locked | Locked |
| Risk rating | Locked | Locked | Locked |
Company overview
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Consensus from external analysts. Not Kvantra's opinion.
Based on consensus from external analysts. Not Kvantra's opinion.
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.
