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Tanyuan Technology Co., Ltd. (603133.SS)
Key financial summary
Financials in CNY| 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | TTM | ||
|---|---|---|---|---|---|---|---|---|
| Total revenue | CNY m | 542 | 548 | 563 | 323 | 107 | 144 | 137 |
| Operating profit | CNY m | -83 | -83 | |||||
| Net profit | CNY m | 54 | -46 | -98 | -482 | -95 | -67 | -65 |
| EPS reported | CNY | -0.32 | -0.31 | |||||
| Operating cashflow per share | CNY | -0.12 | -0.12 | |||||
| Capex per share | CNY | 0.03 | 0.03 | |||||
| FCF per share | CNY | -0.16 | -0.16 | |||||
| Free cash flow | CNY m | -33 | -45 | |||||
| Net debt | CNY m | 73 | 72 | |||||
| Book value equity | CNY m | 215 | 205 | |||||
| Book value per share | CNY | 1.03 | 0.98 | |||||
| Number of shares | m | 208.46 | 209.19 | |||||
| DPS (TTM paid) | CNY | 0.01 | 0.00 |
Financial summary
Financials in CNY| 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | TTM | ||
|---|---|---|---|---|---|---|---|---|
| Value | ||||||||
| P/E TTM | x | - | - | |||||
| P/B LTM | x | 6.93 | 0.29 | |||||
| P/S LTM | x | 10.31 | 0.43 | |||||
| P/FCF LTM | x | -45.26 | -1.31 | |||||
| EV/EBITDA LTM | x | -54.84 | -2.61 | |||||
| EV/Sales LTM | x | 10.82 | 0.95 | |||||
| Earnings Yield LTM | % | -4.48% | -114.29% | |||||
| FCF Yield | % | -2.21% | -76.32% | |||||
| Quality | ||||||||
| ROE | % | -31.02% | -26.88% | |||||
| ROIC | % | -24.24% | -24.24% | |||||
| Operating margin | % | -57.48% | -57.48% | |||||
| Gross margin | % | -0.83% | -0.83% | |||||
| FCF/Sales | % | -22.79% | -22.79% | |||||
| Growth and momentum | ||||||||
| EPS Growth YoY | % | - | - | |||||
| Sales Growth YoY | % | +34.88% | +18.47% | |||||
| Net Income Growth YoY | % | - | - | |||||
| FCF Growth | % | - | - | |||||
| Operating Profit Growth | % | - | - | |||||
| Dividend and capital structure | ||||||||
| Dividend Yield | % | 0.20% | 0.00% | |||||
| Dividend Growth | % | - | - | |||||
| Payout Ratio | % | -4.55% | -4.70% | |||||
| FCF/Debt | x | -0.34 | -0.46 | |||||
| Net Debt/EBITDA | x | -2.55 | -2.55 | |||||
| EBIT/Net interest | x | -21.18 | -21.18 | |||||
| Net debt/market cap | % | 4.88% | 123.55% | |||||
| Net debt/Equity | x | 0.34 | 0.35 | |||||
| Gross debt/equity | x | 0.45 | 0.48 | |||||
Company overview
Tanyuan Technology Co., Ltd., an enterprise established in 2010 and headquartered in Changzhou, China, specializes in the research, development, manufacturing, and distribution of advanced thermal management solutions across China. The company's core product offerings include highly conductive graphite films, ultra-thin heat pipes, and slim heat dissipation plates. These specialized materials and components are extensively utilized in various portable electronic devices, such as smartphones, tablet computers, and notebook computers. Beyond its thermal management focus, Tanyuan Technology also provides glass and ceramic panel backplanes, structural components for smartphone exteriors, and dedicated Wuheng systems for green building applications.
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For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
Tanyuan Technology Co., Ltd. (603133.SS)
Tanyuan Technology Co., Ltd., an enterprise established in 2010 and headquartered in Changzhou, China, specializes in the research, development, manufacturing, and distribution of advanced thermal management solutions across China. The company's core product offerings include highly conductive graphite films, ultra-thin heat pipes, and slim heat dissipation plates. These specialized materials and components are extensively utilized in various portable electronic devices, such as smartphones, tablet computers, and notebook computers. Beyond its thermal management focus, Tanyuan Technology also provides glass and ceramic panel backplanes, structural components for smartphone exteriors, and dedicated Wuheng systems for green building applications.
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