No price history available.
Key financial summary
Financials in JPY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | ¥m | 41,956 | 51,731 | 58,394 | 51,423 | 62,503 | 69,404 | N/A | N/A |
| Operating profit | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | ¥m | 5,607 | 9,156 | 10,594 | 6,499 | 9,429 | 9,060 | N/A | N/A |
| EPS reported | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in JPY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Fujimi Incorporated, established in Kiyosu, Japan, in 1950, specializes in the global production and distribution of high-precision synthetic abrasive materials. With a market presence spanning Japan, Asia, North America, Oceania, and Europe, the company delivers solutions for critical processes such as slicing crystal silicon ingots and the lapping and polishing of silicon wafers. Fujimi also supplies essential abrasive compounds, including CMP slurry, for semiconductor device manufacturing, as well as polishing agents specifically developed for hard disk drive magnetic platters. Furthermore, the company provides an array of specialized materials, such as lapping and polishing compounds, diamond products, and catalyst carriers, which are integral to industries like electronic components, LED lighting, automotive, optical lenses, and power semiconductors. Additionally, Fujimi offers thermal spray materials that are crucial for applications in aerospace, semiconductors, liquid crystal displays, steel production, energy, and chemicals.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Fujimi Incorporated, established in Kiyosu, Japan, in 1950, specializes in the global production and distribution of high-precision synthetic abrasive materials. With a market presence spanning Japan, Asia, North America, Oceania, and Europe, the company delivers solutions for critical processes such as slicing crystal silicon ingots and the lapping and polishing of silicon wafers. Fujimi also supplies essential abrasive compounds, including CMP slurry, for semiconductor device manufacturing, as well as polishing agents specifically developed for hard disk drive magnetic platters. Furthermore, the company provides an array of specialized materials, such as lapping and polishing compounds, diamond products, and catalyst carriers, which are integral to industries like electronic components, LED lighting, automotive, optical lenses, and power semiconductors. Additionally, Fujimi offers thermal spray materials that are crucial for applications in aerospace, semiconductors, liquid crystal displays, steel production, energy, and chemicals.
