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Unisem (M) Berhad specializes in the production and distribution of semiconductor components, offering a comprehensive suite of packaging and testing solutions. These services encompass initial wafer processing, including bumping, probing, and grinding, along with advanced wafer-level chip-scale packaging and radio frequency capabilities. The company also provides a diverse range of leadframe and substrate-based integrated circuit packages, alongside extensive testing for analog, digital, and mixed-signal circuits. Supplemental test-related offerings include reliability assessments, thermal and electrical performance characterization, protective dry packing, and tape-and-reel packaging. Unisem further extends its semiconductor assembly and testing proficiency to electronics companies. For a complete solution, they deliver end-to-end (turnkey) services covering design, assembly, testing, failure analysis, warehousing, and direct shipping. Additionally, the company provides marketing and other auxiliary support. Its primary clientele comprises fabless semiconductor firms and integrated device manufacturers situated across North America, Europe, and Asia. Established in 1989 and headquartered in Kuala Lumpur, Malaysia, Unisem (M) Berhad operates as a subsidiary of Huatian Technology (Malaysia) Sdn. Bhd.

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