No price history available.
Key financial summary
Financials in HKD| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | HKDm | 14,700 | 21,948 | 19,363 | 14,697 | 13,229 | 13,736 | N/A | N/A |
| Operating profit | HKDm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | HKDm | 1,622 | 3,169 | 2,620 | 715 | 345 | 902 | N/A | N/A |
| EPS reported | HKD | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | HKD | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | HKD | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | HKD | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | HKDm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | HKDm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | HKDm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | HKD | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | HKD | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in HKD| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Operating on a global scale, ASMPT Limited functions as an investment holding company dedicated to the engineering, manufacturing, and commercialization of critical machinery, tools, and materials for the semiconductor and electronics assembly industries. The company's operations are divided into two main segments: Semiconductor Solutions and Surface Mount Technology Solutions. Its extensive product range includes equipment for deposition processes, wafer separation, automated optical inspection (AOI/FOL), die attachment, wire bonding, and material dispensing. ASMPT also supplies specialized encapsulation and CMOS Image Sensor (CIS) equipment, as well as systems for singulation, trim and form, LED testing, sorting, taping, sintering, and final test and handling. Moreover, the company offers cutting-edge solutions across various domains, such as surface mount technologies (SMT), advanced packaging, Micro-Electro-Mechanical Systems (MEMS), power management, LED/optoelectronics, photonics, Chip-on-Board (COB), and stacked die solutions, alongside smart SMT factory solutions and image sensor applications. In addition to these, ASMPT provides agency and logistics services. Founded in 1975 and headquartered in Tsing Yi, Hong Kong, the company officially rebranded from ASM Pacific Technology Limited to ASMPT Limited in June 2022.
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For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Operating on a global scale, ASMPT Limited functions as an investment holding company dedicated to the engineering, manufacturing, and commercialization of critical machinery, tools, and materials for the semiconductor and electronics assembly industries. The company's operations are divided into two main segments: Semiconductor Solutions and Surface Mount Technology Solutions. Its extensive product range includes equipment for deposition processes, wafer separation, automated optical inspection (AOI/FOL), die attachment, wire bonding, and material dispensing. ASMPT also supplies specialized encapsulation and CMOS Image Sensor (CIS) equipment, as well as systems for singulation, trim and form, LED testing, sorting, taping, sintering, and final test and handling. Moreover, the company offers cutting-edge solutions across various domains, such as surface mount technologies (SMT), advanced packaging, Micro-Electro-Mechanical Systems (MEMS), power management, LED/optoelectronics, photonics, Chip-on-Board (COB), and stacked die solutions, alongside smart SMT factory solutions and image sensor applications. In addition to these, ASMPT provides agency and logistics services. Founded in 1975 and headquartered in Tsing Yi, Hong Kong, the company officially rebranded from ASM Pacific Technology Limited to ASMPT Limited in June 2022.