Piotech Inc (688072.SS)
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No price history available.
Key financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | CNY m | 436 | 754 | 1,706 | 2,705 | 4,103 | 6,519 | 5,507 | 9,307 |
| Operating profit | CNY m | 875 | 1,623 | ||||||
| Net profit | CNY m | -11 | 68 | 368 | 663 | 688 | 927 | 1,858 | 2,224 |
| EPS reported | CNY | 3.29 | 6.53 | ||||||
| Operating cashflow per share | CNY | 13.02 | 7.77 | ||||||
| Capex per share | CNY | 2.06 | 2.06 | ||||||
| FCF per share | CNY | 10.95 | 5.71 | ||||||
| Free cash flow | CNY m | 3,058 | 1,609 | ||||||
| Net debt | CNY m | -1,825 | -7,074 | ||||||
| Book value equity | CNY m | 6,610 | 12,716 | ||||||
| Book value per share | CNY | 23.47 | 44.46 | ||||||
| Number of shares | m | 281.67 | 285.98 | ||||||
| DPS (TTM paid) | CNY | 0.33 | 0.33 |
Financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E TTM | x | 100.30 | 157.85 | ||||||
| P/B LTM | x | 13.94 | 7.24 | ||||||
| P/S LTM | x | 14.13 | 16.72 | ||||||
| P/FCF LTM | x | 30.12 | 57.26 | ||||||
| EV/EBITDA LTM | x | 83.34 | 70.02 | ||||||
| EV/Sales LTM | x | 13.99 | 31.80 | ||||||
| Earnings Yield LTM | % | +1.00% | +0.63% | ||||||
| FCF Yield | % | +3.32% | +1.75% | ||||||
| Quality | |||||||||
| ROE | % | +14.02% | +27.52% | ||||||
| ROIC | % | +7.31% | +9.17% | ||||||
| Operating margin | % | +13.43% | +29.46% | ||||||
| Gross margin | % | +34.95% | +37.46% | ||||||
| FCF/Sales | % | +46.90% | +29.21% | ||||||
| Growth and momentum | |||||||||
| EPS Growth YoY | % | +33.74% | +165.45% | ||||||
| Sales Growth YoY | % | +58.87% | +34.22% | ||||||
| Net Income Growth YoY | % | +34.67% | +169.98% | ||||||
| FCF Growth | % | - | - | ||||||
| Operating Profit Growth | % | +28.98% | +139.06% | ||||||
| Dividend and capital structure | |||||||||
| Dividend Yield | % | +0.17% | +0.05% | ||||||
| Dividend Growth | % | +22.22% | +22.22% | ||||||
| Payout Ratio | % | +17.02% | +13.51% | ||||||
| FCF/Debt | x | 0.70 | 0.60 | ||||||
| Net Debt/EBITDA | x | -0.85 | -3.72 | ||||||
| EBIT/Net interest | x | 10.41 | 33.48 | ||||||
| Net debt/market cap | % | +4.74% | +1.48% | ||||||
| Net debt/Equity | x | -0.28 | -0.56 | ||||||
| Gross debt/equity | x | 0.66 | 0.21 | ||||||
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Piotech Inc. engages in the research and development, production, sales, and technical services of semiconductor equipment in China. The company offers thin film equipment, such as plasma-enhanced chemical vapor deposition equipment, atomic layer deposition equipment, sub-atmospheric pressure chemical vapor deposition equipment, and high-density plasma-enhanced chemical vapor deposition equipment are used in integrated circuit logic chips, memory chips, and other manufacturing lines. It also provides hybrid bonding equipment used in the field of wafer-level three-dimensional integration. The company was founded in 2010 and is headquartered in Shenyang, China.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Piotech Inc. engages in the research and development, production, sales, and technical services of semiconductor equipment in China. The company offers thin film equipment, such as plasma-enhanced chemical vapor deposition equipment, atomic layer deposition equipment, sub-atmospheric pressure chemical vapor deposition equipment, and high-density plasma-enhanced chemical vapor deposition equipment are used in integrated circuit logic chips, memory chips, and other manufacturing lines. It also provides hybrid bonding equipment used in the field of wafer-level three-dimensional integration. The company was founded in 2010 and is headquartered in Shenyang, China.
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