No price history available.
Key financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | CNYm | 7,064 | 9,532 | 10,514 | 10,757 | 12,659 | 15,275 | N/A | N/A |
| Operating profit | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | CNYm | 921 | 935 | 1,066 | 936 | 1,169 | 1,231 | N/A | N/A |
| EPS reported | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Shenzhen Kinwong Electronic Co., Ltd. operates globally, focusing on the innovation, production, and sale of advanced printed circuit boards (PCBs) and electronic components. Their comprehensive product portfolio features standard PCBs, including single-sided, double-sided, and multi-layered variants. They also manufacture metal-core PCBs utilizing materials such as copper, aluminum, stainless steel, and iron, alongside flexible PCBs available in single-sided, double-sided, and multilayer configurations. Furthermore, the company provides specialized solutions like high-density interconnect (HDI) PCBs, RF microwave PCBs, rigid-flex PCBs, high layer count PCBs, and integrated copper inlays. In addition to manufacturing, Kinwong offers expert engineering and design services. Their market reach is extensive, serving industries such as automotive, smart devices, consumer electronics, power management, telecommunications, industrial and medical technology, and computing. Established in 1993 and based in Shenzhen, China, the company was formerly part of Kinwong Group Limited.
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Shenzhen Kinwong Electronic Co., Ltd. (603228.SS)
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Shenzhen Kinwong Electronic Co., Ltd. operates globally, focusing on the innovation, production, and sale of advanced printed circuit boards (PCBs) and electronic components. Their comprehensive product portfolio features standard PCBs, including single-sided, double-sided, and multi-layered variants. They also manufacture metal-core PCBs utilizing materials such as copper, aluminum, stainless steel, and iron, alongside flexible PCBs available in single-sided, double-sided, and multilayer configurations. Furthermore, the company provides specialized solutions like high-density interconnect (HDI) PCBs, RF microwave PCBs, rigid-flex PCBs, high layer count PCBs, and integrated copper inlays. In addition to manufacturing, Kinwong offers expert engineering and design services. Their market reach is extensive, serving industries such as automotive, smart devices, consumer electronics, power management, telecommunications, industrial and medical technology, and computing. Established in 1993 and based in Shenzhen, China, the company was formerly part of Kinwong Group Limited.