Full history for every metric is available with a Kvantra account
Key financial summary
Financials in EUR| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | €m | 434 | 749 | 723 | 579 | 607 | 591 | 734 | 1,008 |
| Operating profit | €m | 173 | 263 | ||||||
| Net profit | €m | 132 | 282 | 241 | 177 | 182 | 132 | 209 | 351 |
| EPS reported | € | 1.66 | 2.60 | ||||||
| Operating cashflow per share | € | 2.25 | 3.10 | ||||||
| Capex per share | € | 0.20 | 0.08 | ||||||
| FCF per share | € | 2.05 | 3.02 | ||||||
| Free cash flow | €m | 162 | 242 | ||||||
| Net debt | €m | -25 | -151 | ||||||
| Book value equity | €m | 416 | 573 | ||||||
| Book value per share | € | 5.22 | 7.08 | ||||||
| Number of shares | m | 79.75 | 80.93 | ||||||
| DPS (TTM paid) | € | 1.58 | 1.58 |
Financial summary
Financials in EUR| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E TTM | x | 80.57 | 69.02 | ||||||
| P/B LTM | x | 25.42 | 24.79 | ||||||
| P/S LTM | x | 17.90 | 19.36 | ||||||
| P/FCF LTM | x | 65.19 | 58.70 | ||||||
| EV/EBITDA LTM | x | 51.94 | 46.17 | ||||||
| EV/Sales LTM | x | 18.16 | 19.16 | ||||||
| Earnings Yield LTM | % | 1.24% | 1.45% | ||||||
| FCF Yield | % | 1.53% | 1.70% | ||||||
| Quality | |||||||||
| ROE | % | 31.61% | 46.17% | ||||||
| ROIC | % | 15.42% | 23.91% | ||||||
| Operating margin | % | 29.27% | 35.84% | ||||||
| Gross margin | % | 63.29% | 62.52% | ||||||
| FCF/Sales | % | 27.45% | 32.98% | ||||||
| Growth and momentum | |||||||||
| EPS Growth YoY | % | -27.83% | +25.00% | ||||||
| Sales Growth YoY | % | -2.66% | +21.85% | ||||||
| Net Income Growth YoY | % | -27.67% | +23.02% | ||||||
| FCF Growth | % | -4.28% | +40.33% | ||||||
| Operating Profit Growth | % | -11.52% | +39.62% | ||||||
| Dividend and capital structure | |||||||||
| Dividend Yield | % | 1.63% | 0.88% | ||||||
| Dividend Growth | % | -27.52% | -27.52% | ||||||
| Payout Ratio | % | 130.54% | 60.07% | ||||||
| FCF/Debt | x | 0.31 | 0.68 | ||||||
| Net Debt/EBITDA | x | 0.76 | 0.03 | ||||||
| EBIT/Net interest | x | 9.06 | 9.50 | ||||||
| Net debt/market cap | % | -0.23% | -1.06% | ||||||
| Net debt/Equity | x | -0.06 | -0.26 | ||||||
| Gross debt/equity | x | 1.27 | 0.62 | ||||||
ETFs that hold BE Semiconductor Industries
| Fund | Ticker | Position# | Weight |
|---|---|---|---|
| Amundi STOXX Europe 600 Industrials UCITS ETF Acc | IND.PA | 8 | 3.97% |
| Amundi STOXX Europe 600 Technology UCITS ETF Acc | TNO.PA | 6 | 4.47% |
| Innovator Deepwater Frontier Tech ETF | LOUP | 2 | 4.44% |
| Deka STOXX Europe Strong Growth 20 UCITS ETF | EL4C.DE | 8 | 5.13% |
| Amundi STOXX Europe 600 Telecommunications UCITS ETF Acc | TELE.PA | 10 | 3.70% |
Funds with BE Semiconductor Industries among their ten largest holdings, largest fund first.
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
BE Semiconductor Industries N.V. (BESI.AS)
| Fund | Ticker | Position# | Weight |
|---|---|---|---|
| Amundi STOXX Europe 600 Industrials UCITS ETF Acc | IND.PA | 8 | 3.97% |
| Amundi STOXX Europe 600 Technology UCITS ETF Acc | TNO.PA | 6 | 4.47% |
| Innovator Deepwater Frontier Tech ETF | LOUP | 2 | 4.44% |
| Deka STOXX Europe Strong Growth 20 UCITS ETF | EL4C.DE | 8 | 5.13% |
| Amundi STOXX Europe 600 Telecommunications UCITS ETF Acc | TELE.PA | 10 | 3.70% |
Funds with BE Semiconductor Industries among their ten largest holdings, largest fund first.
Based on consensus from external analysts. Not Kvantra's opinion.
BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
Unlock all fundamental data
Sign up for FreeUnlock all fundamental data
Sign up for Free