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TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.

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