HIIG Trinity (Anhui) Technology Co., Ltd.(600520.SS)
No price history available.
Key financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | CNYm | 332 | 444 | 444 | 331 | 314 | 379 | N/A | N/A |
| Operating profit | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | CNYm | 8 | 9 | 26 | -81 | 22 | 8 | N/A | N/A |
| EPS reported | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
WenYi Trinity Technology Co., Ltd specializes in the design, manufacturing, and global distribution of semiconductor plastic packaging molds and associated equipment, serving both Chinese and international markets. The company offers a comprehensive range of products, including integrated circuit packaging molds, advanced automatic cutting and forming systems, chip packaging machines, robotic integration systems for chip packaging, sorting machines, and LED dispensers. Their portfolio also extends to precision spare parts crucial for semiconductor operations, alongside extrusion molds and various precision hardware components for general industrial applications. Beyond its core semiconductor focus, WenYi Trinity diversifies its offerings to include chemical building materials, a variety of plastic and color aluminum doors and windows, and automotive components such as metal stamping and injection molding products. Founded in 2000, the company initially operated as Tongling Zhongfa Sanjia Technology Co., Ltd before rebranding to WenYi Trinity Technology Co., Ltd in 2011. Its headquarters are situated in Tongling, in the People's Republic of China.
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HIIG Trinity (Anhui) Technology Co., Ltd. (600520.SS)
No price history available.
Not enough data to calculate KvantraRank
Based on consensus from external analysts. Not Kvantra's opinion.
WenYi Trinity Technology Co., Ltd specializes in the design, manufacturing, and global distribution of semiconductor plastic packaging molds and associated equipment, serving both Chinese and international markets. The company offers a comprehensive range of products, including integrated circuit packaging molds, advanced automatic cutting and forming systems, chip packaging machines, robotic integration systems for chip packaging, sorting machines, and LED dispensers. Their portfolio also extends to precision spare parts crucial for semiconductor operations, alongside extrusion molds and various precision hardware components for general industrial applications. Beyond its core semiconductor focus, WenYi Trinity diversifies its offerings to include chemical building materials, a variety of plastic and color aluminum doors and windows, and automotive components such as metal stamping and injection molding products. Founded in 2000, the company initially operated as Tongling Zhongfa Sanjia Technology Co., Ltd before rebranding to WenYi Trinity Technology Co., Ltd in 2011. Its headquarters are situated in Tongling, in the People's Republic of China.