No price history available.
Key financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | CNYm | 14,687 | 20,274 | 18,014 | 16,586 | 20,388 | 28,431 | N/A | N/A |
| Operating profit | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | CNYm | 1,681 | 2,830 | 1,531 | 1,164 | 1,739 | 3,334 | N/A | N/A |
| EPS reported | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Shengyi Technology Co., Ltd., established in 1985 in Dongguan, China, and formerly known as Guangdong Shengyi Sci. Tech Co., Ltd., is a leading enterprise specializing in the development, production, and sale of laminates and advanced electronic base materials. The company's diverse product portfolio includes flame-retardant epoxy glass fabric reinforced laminates, various composite epoxy materials, and flexible circuit materials. They also provide essential prepregs for multilayer circuit board fabrication, alongside a comprehensive range of high-end electronic materials such as copper clad laminates (CCL), insulation boards, resin-coated copper, and coverlay materials. Furthermore, Shengyi Technology offers specific electronic circuit base materials, including FR-4 CCL, flexible copper clad laminates (FCCL), aluminum base materials, and specialized high-speed (HSD) and radio frequency (RF) materials. These products are crucial for manufacturing single-sided, double-sided, and multilayer printed circuit boards, which are extensively utilized across a broad spectrum of industries, including home appliances, portable and consumer electronics, automotive, computing, and aerospace applications. Beyond its strong presence in the Chinese market, the company actively exports its materials to customers in the Americas, Europe, Korea, Japan, and Southeast Asia.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
Shengyi Technology Co.,Ltd. (600183.SS)
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Shengyi Technology Co., Ltd., established in 1985 in Dongguan, China, and formerly known as Guangdong Shengyi Sci. Tech Co., Ltd., is a leading enterprise specializing in the development, production, and sale of laminates and advanced electronic base materials. The company's diverse product portfolio includes flame-retardant epoxy glass fabric reinforced laminates, various composite epoxy materials, and flexible circuit materials. They also provide essential prepregs for multilayer circuit board fabrication, alongside a comprehensive range of high-end electronic materials such as copper clad laminates (CCL), insulation boards, resin-coated copper, and coverlay materials. Furthermore, Shengyi Technology offers specific electronic circuit base materials, including FR-4 CCL, flexible copper clad laminates (FCCL), aluminum base materials, and specialized high-speed (HSD) and radio frequency (RF) materials. These products are crucial for manufacturing single-sided, double-sided, and multilayer printed circuit boards, which are extensively utilized across a broad spectrum of industries, including home appliances, portable and consumer electronics, automotive, computing, and aerospace applications. Beyond its strong presence in the Chinese market, the company actively exports its materials to customers in the Americas, Europe, Korea, Japan, and Southeast Asia.