No price history available.
Key financial summary
Financials in JPY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | ¥m | 16,622 | 18,714 | 16,255 | 11,420 | 12,611 | 18,073 | N/A | N/A |
| Operating profit | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | ¥m | 791 | 974 | 570 | 548 | 1,580 | 1,804 | N/A | N/A |
| EPS reported | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | ¥m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | ¥ | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in JPY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Japan Pure Chemical Co.,Ltd. develops, manufactures, and sells precious metal plating chemicals for electronic components in Japan and internationally. The company provides gold electrolytic plating formulation for semiconductor applications, as well as PWB, connector, contact, and soldering applications; strike gold plating formulation for lead frame applications; flash gold plating formulation for leadframe uses; and palladium electrolytic formulation for connector and lead frame uses. It also offers gold plating formulation for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and electrolytic and electroless silver plating formulations. In addition, the company provides anti bacterial agents for plating tanks and drag-out tanks; and impurity removal resin that removes Cu ions dissolved in Au and palladium plating formulation. Additionally, it offers surface treatment chemicals and stripping agents. Japan Pure Chemical Co.,Ltd. was founded in 1971 and is based in Tokyo, Japan.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
Japan Pure Chemical Co.,Ltd. (4973.T)
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Japan Pure Chemical Co.,Ltd. develops, manufactures, and sells precious metal plating chemicals for electronic components in Japan and internationally. The company provides gold electrolytic plating formulation for semiconductor applications, as well as PWB, connector, contact, and soldering applications; strike gold plating formulation for lead frame applications; flash gold plating formulation for leadframe uses; and palladium electrolytic formulation for connector and lead frame uses. It also offers gold plating formulation for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and electrolytic and electroless silver plating formulations. In addition, the company provides anti bacterial agents for plating tanks and drag-out tanks; and impurity removal resin that removes Cu ions dissolved in Au and palladium plating formulation. Additionally, it offers surface treatment chemicals and stripping agents. Japan Pure Chemical Co.,Ltd. was founded in 1971 and is based in Tokyo, Japan.
