No price history available.
Key financial summary
Financials in KRW| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | KRWm | 49,445 | 57,109 | 114,943 | 87,931 | 113,720 | 67,029 | N/A | N/A |
| Operating profit | KRWm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | KRWm | 14,712 | 18,075 | 43,410 | 30,934 | 38,428 | -6,812 | N/A | N/A |
| EPS reported | KRW | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | KRW | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | KRW | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | KRW | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | KRWm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | KRWm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | KRWm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | KRW | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | KRW | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in KRW| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
NEXTIN, Inc., established in 2010 and based in Hwaseong-si, South Korea, develops and manufactures advanced systems for defect inspection and precision measurement, catering to the semiconductor and display sectors. Its product portfolio features AEGIS wafer inspection systems, which effectively pinpoint various flaws such as bridges, thinning, protrusions, footing issues, scratches, and particulate contamination throughout essential semiconductor manufacturing steps like film deposition, pattern creation, planarization, ion implantation, and cleaning. The company also provides IRIS, a sophisticated wafer metrology-inspection system designed to accurately gauge vertical structures and uncover pattern defects during High Aspect Ratio (HAR) processes in 3D semiconductor devices and Through-Silicon Via (TSV) processing for advanced 3D packaging. Additionally, NEXTIN offers TWINS, an integration module engineered to be installed directly onto process equipment, enabling the measurement of edge trimming operations and the inspection of related process defects.
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For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
NEXTIN, Inc., established in 2010 and based in Hwaseong-si, South Korea, develops and manufactures advanced systems for defect inspection and precision measurement, catering to the semiconductor and display sectors. Its product portfolio features AEGIS wafer inspection systems, which effectively pinpoint various flaws such as bridges, thinning, protrusions, footing issues, scratches, and particulate contamination throughout essential semiconductor manufacturing steps like film deposition, pattern creation, planarization, ion implantation, and cleaning. The company also provides IRIS, a sophisticated wafer metrology-inspection system designed to accurately gauge vertical structures and uncover pattern defects during High Aspect Ratio (HAR) processes in 3D semiconductor devices and Through-Silicon Via (TSV) processing for advanced 3D packaging. Additionally, NEXTIN offers TWINS, an integration module engineered to be installed directly onto process equipment, enabling the measurement of edge trimming operations and the inspection of related process defects.