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Greatek Electronics Inc. specializes in the assembly and testing of diverse integrated circuits (ICs), serving clients across Taiwan, the United States, Europe, Asia, and Africa. The company provides an extensive array of packaging solutions, encompassing traditional lead frame, quad flat no-lead (QFN), ball grid array (BGA), and flip chip technologies. Its portfolio also features advanced wafer-level chip scale (WLCSP) solutions, bumping technology, backend integration for WLCSP, flash memory packaging, BGA/LGA production, FC/CSP, automotive-grade packages, and secure IC assembly. Additionally, Greatek manufactures various leadframe-based packages such as P-DIP, TO/SOT/TSOT, SOP, mini-SOP, shrink SOP, thin shrink SOP, SOJ, PLCC, QFP, low profile QFP, and thin QFP. Beyond packaging, Greatek delivers comprehensive wafer and final testing services. These include developing test programs, platform conversion, device correlation, engineering support, and the creation of test peripheral equipment and spare parts, catering to logic, mixed-mode, and analog devices. The company further offers general IC semiconductor package assembly and specialized package design services, focusing on electrical and thermal performance characterization. Established in 1972, Greatek Electronics Inc. was previously known as He Teh Integrated Circuit Co. Ltd. and maintains its headquarters in Miaoli, Taiwan.

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