No price history available.
Key financial summary
Financials in MYR| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | MYRm | 1,057 | 1,429 | 1,548 | 1,354 | 1,479 | 1,352 | N/A | N/A |
| Operating profit | MYRm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | MYRm | 156 | 330 | 391 | 324 | 300 | 219 | N/A | N/A |
| EPS reported | MYR | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | MYR | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | MYR | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | MYR | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | MYRm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | MYRm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | MYRm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | MYR | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | MYR | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in MYR| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Inari Amertron Berhad, established in Petaling Jaya, Malaysia in 2006, operates as an investment holding company with a core focus on providing electronic manufacturing services (EMS) and outsourced semiconductor assembly and testing (OSAT). The company’s international reach spans Malaysia, Singapore, the United States, China, and the Philippines. Specializing in radio frequency (RF), fiber-optic transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies, Inari offers a wide array of services. These include advanced wafer processing, such as bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. For fiber optic chips, it provides fabrication and certification, encompassing wafer scribe and cleave, bar alignment, demount-load fixtures, facet coating, and chip-on-carrier solutions. The company also excels in sophisticated system-in-package (SiP) assembly and testing. This involves fine-pitch surface mount technology (SMT), high-speed and high-accuracy flip-chip placement, in-line post-vision, molding underfill, post-mold oxide plating, and final testing for advanced communication chips. Additional services cover new product introduction (NPI), failure analysis, design and characterization for sensor and IC packages, process customization, product testing, box build, and direct-to-end-customer dropshipping. Furthermore, Inari Amertron manufactures electronic optical fiber and optoelectronic devices, communication chips, and prepares dies. It undertakes the manufacturing, assembly, and testing of various optoelectronic and sensor components, modules, and systems. The company also designs and develops fiber optic products, alongside designing, assembling, and supplying both standard and customized semiconductor manufacturing process tools and their parts. Its portfolio also includes property investments.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
No price history available.
Based on consensus from external analysts. Not Kvantra's opinion.
Inari Amertron Berhad, established in Petaling Jaya, Malaysia in 2006, operates as an investment holding company with a core focus on providing electronic manufacturing services (EMS) and outsourced semiconductor assembly and testing (OSAT). The company’s international reach spans Malaysia, Singapore, the United States, China, and the Philippines. Specializing in radio frequency (RF), fiber-optic transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies, Inari offers a wide array of services. These include advanced wafer processing, such as bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. For fiber optic chips, it provides fabrication and certification, encompassing wafer scribe and cleave, bar alignment, demount-load fixtures, facet coating, and chip-on-carrier solutions. The company also excels in sophisticated system-in-package (SiP) assembly and testing. This involves fine-pitch surface mount technology (SMT), high-speed and high-accuracy flip-chip placement, in-line post-vision, molding underfill, post-mold oxide plating, and final testing for advanced communication chips. Additional services cover new product introduction (NPI), failure analysis, design and characterization for sensor and IC packages, process customization, product testing, box build, and direct-to-end-customer dropshipping. Furthermore, Inari Amertron manufactures electronic optical fiber and optoelectronic devices, communication chips, and prepares dies. It undertakes the manufacturing, assembly, and testing of various optoelectronic and sensor components, modules, and systems. The company also designs and develops fiber optic products, alongside designing, assembling, and supplying both standard and customized semiconductor manufacturing process tools and their parts. Its portfolio also includes property investments.
