No price history available.
Key financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Total revenue | CNYm | 2,340 | 2,945 | 3,054 | 2,624 | 2,932 | 3,141 | N/A | N/A |
| Operating profit | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net profit | CNYm | 162 | 148 | -179 | -137 | -87 | 27 | N/A | N/A |
| EPS reported | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating cashflow per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Capex per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Free cash flow | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value equity | CNYm | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Book value per share | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Number of shares | m | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| DPS (TTM paid) | CNY | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Financial summary
Financials in CNY| 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | TTM | 2026E | ||
|---|---|---|---|---|---|---|---|---|---|
| Value | |||||||||
| P/E LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/B LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/S LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| P/FCF LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/EBITDA LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EV/Sales LTM | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Earnings Yield LTM | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Quality | |||||||||
| ROE | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| ROIC | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross margin | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Sales | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Growth and momentum | |||||||||
| EPS Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Sales Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Income Growth YoY | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Operating Profit Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend and capital structure | |||||||||
| Dividend Yield | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Dividend Growth | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Payout Ratio | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| FCF/Debt | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net Debt/EBITDA | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| EBIT/Net interest | x | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/market cap | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Net debt/Equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
| Gross debt/equity | % | Locked | Locked | Locked | Locked | Locked | Locked | Locked | Locked |
Ratings
Based on consensus from external analysts. Not Kvantra's opinion.
Company overview
Huizhou CEE Technology Inc. operates globally, specializing in the comprehensive development, manufacturing, sales, and servicing of printed circuit boards (PCBs). Its extensive product portfolio encompasses various advanced PCB types, including standard rigid circuit boards (RPCBs), flexible circuit boards (FPCs), and hybrid rigid-flexible boards (RFs). They also provide high-density interconnect (HDI) solutions, including high-order and AnylayerHDIs, alongside high-layer circuit boards (HLCs) and flexible circuit board assemblies (FPCAs). These critical components are integral to a vast array of sectors and advanced applications. The company has a strong presence in burgeoning areas like network communications, cutting-edge high-definition displays, new energy vehicles, data centers, artificial intelligence (AI), the Internet of Things (IoT), big data analytics, and cloud computing. Beyond these, their PCBs find widespread utility across consumer electronics, security systems, industrial control, medical and healthcare devices, biometrics, wearables, smart home technology, and unmanned aerial vehicles (drones). Established in 2000, the company maintains its headquarters in Huizhou, China. It underwent a name change in June 2024, transitioning from its former identity as Huizhou China Eagle Electronic Technology Inc. to its current designation, Huizhou CEE Technology Inc.
Similar companies
For informational purposes only. Kvantra provides data and quantitative analysis, not investment advice. KvantraRank is a mechanical model output. Analyst price targets and ratings are sourced from third parties and are not Kvantra recommendations. Past performance does not guarantee future results; all investments carry risk.
Huizhou CEE Technology Inc. Class A (002579.SZ)
No price history available.
Not enough data to calculate KvantraRank
Based on consensus from external analysts. Not Kvantra's opinion.
Huizhou CEE Technology Inc. operates globally, specializing in the comprehensive development, manufacturing, sales, and servicing of printed circuit boards (PCBs). Its extensive product portfolio encompasses various advanced PCB types, including standard rigid circuit boards (RPCBs), flexible circuit boards (FPCs), and hybrid rigid-flexible boards (RFs). They also provide high-density interconnect (HDI) solutions, including high-order and AnylayerHDIs, alongside high-layer circuit boards (HLCs) and flexible circuit board assemblies (FPCAs). These critical components are integral to a vast array of sectors and advanced applications. The company has a strong presence in burgeoning areas like network communications, cutting-edge high-definition displays, new energy vehicles, data centers, artificial intelligence (AI), the Internet of Things (IoT), big data analytics, and cloud computing. Beyond these, their PCBs find widespread utility across consumer electronics, security systems, industrial control, medical and healthcare devices, biometrics, wearables, smart home technology, and unmanned aerial vehicles (drones). Established in 2000, the company maintains its headquarters in Huizhou, China. It underwent a name change in June 2024, transitioning from its former identity as Huizhou China Eagle Electronic Technology Inc. to its current designation, Huizhou CEE Technology Inc.